LINEAR MOTOR PICKER

• Linear Motor is a circular motor method implemented in a straight-line drive method

• It drives by driving with the thrust force by sending current to the coil and attraction and repulsion with the permanent magnet

• Speed ​​and force can be controlled by controlling the amount of current flowing to the coil

• U, V, W 3-phase motor method, forward, backward, and stop are possible depending on the direction of current sending

• Micro-unit precision implementation of the process is possible

• The coil is located in the air within the magnetic field of the permanent magnet, so there is no vibration or load when driving, allowing for micro-unit precision control

• Small chip operation possible

• Micro force control is possible through current control, allowing operation without damage to small chips

• A large number of pickers can be attached

• The product is composed of small sizes of 6T, 8T, 9T, and 12T, allowing a large number of picker configurations to match the size of the chip being used.

LINEAR TYPE VARIABLE PITCH MODULE

• The present invention relates to a product used in semiconductor inspection equipment. It transports units used to pick up semiconductor chips. It is an individual transport module that automatically adjusts the spacing between each pickup unit by mounting two to eight pickup units on the product.

• Unit transport devices used in semiconductor manufacturing and inspection equipment typically utilize mechanical drive principles such as CAM PLATEs, circular CAMs, and LINKs. However, these mechanical drive elements often lead to issues with speed, precision, and product wear. Furthermore, while a clean environment is essential within semiconductor equipment, mechanical friction generates particles, negatively impacting semiconductor production.

• CAM PLATE Method: A symmetrical groove is machined around the centerline of the plate, with a wider top and narrower bottom. This groove is coupled to a bearing mounted on the fixed axis of the Pick&Place Unit. This mechanism adjusts the spacing between the Pick&Place Units based on the vertical movement of the plate.

• Circular CAM method: This method uses the same operating principle as the CAM PLATE method, but instead of a plate, a circular column is machined with grooves to adjust the spacing between the Pick&Place Units by rotating the circular CAM.

• LINK method: This method uses diamond-shaped links to widen and narrow the gap between the Links, thereby adjusting the spacing between the Pick&Place Units.

The Unit transport device using a Linear Motor that we are developing is a clean product that does not generate particles due to its non-contact operation. It can achieve speed and precision in the micrometer range, and it is a product that can be used semi-permanently due to the absence of mechanical wear.

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Semiconductor equipment that uses a Unit transport device using a Linear Motor can be expected to increase semiconductor production and dramatically reduce the defect rate.